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| ESDAXXXP6 ASD TransilTM array for ESD protection Main applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: Computers Printers Communication systems and cellular phones Video equipment SOT-666IP (Internal pad) ESDA6V1P6 ESDA6V1-5P6 SOT-666 ESDA14V2BP6 These devices are particularly adapted to the protection of symmetrical signals. Order codes Part Number ESDA6V1P6 ESDA6V1-5P6 ESDA14V2BP6 Marking B C A Features 4 / 5 Unidirectional (ESDA6V1P6 / ESDA6V1-5P6) and Bidirectional (ESDA14V2BP6) Transil functions Breakdown voltage: VBR = 6.1 V min. and 14.2 V min. Low leakage current: < 500 nA (ESDA6V1P6 / ESDA6V1-5P6) < 1 A (ESDA14V2BP6) Very small PCB area < 2.6 mm2 Figure 1. ESDA6V1P6 functional diagram I/O1 GND I/O2 I/O4 GND I/O3 Description The ESDAXXXP6 are monolithic arrays designed to protect up to 5 lines against ESD transients. These devices are ideal for situations where both reduced line capacitance and board space saving are required. Figure 2. ESDA6V1-5P6 functional diagram I/O1 GND I/O2 I/O5 I/O4 I/O3 Benefits High ESD protection level High integration Suitable for high density boards Figure 3. ESDA14V2BP6 functional diagram I/O1 GND I/O2 I/O4 GND I/O3 Complies with the following standards: IEC61000-4-2 level 4: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883E-Method 3015-7: class3 25 kV (Human Body Model) TM: Transil is a trademark of STMicroelectronics June 2006 Rev 2 1/8 www.st.com 8 Characteristics ESDAXXXP6 1 Characteristics Table 1. Symbol PPP Tj Tstg TL Top Absolute Maximum Ratings (Tamb = 25 C) Parameter Peak pulse power (8/20 s) (1) Tj initial = Tamb Junction temperature Storage temperature range Maximum lead temperature for soldering during 10 s at 5 mm for case Operating temperature range ESDA6V1P6 / ESDA6V1-5P6 ESDA14V2BP6 Value 150 W 50 150 -55 to +150 260 -40 to +150 C C C C Unit 1. for a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Symbol VRM VBR VCL IRM IPP T VF C Rd Electrical Characteristics (Tamb = 25 C) Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current Peak pulse current Voltage temperature coefficient Forward voltage drop Capacitance Dynamic resistance Slope: 1/Rd VCLVBR VRM IRM V Slope: 1/Rd IPP VF VCLVBR VRM IRM V Unidirectional I IF Bidirectional I IPP VBR @ IR Part Numbers min. max. IRM max. @ VRM Rd max. T typ. C typ. @ 0V V ESDA6V1P6 6.1 ESDA6V1-5P6 V 7.2 mA 1 A 0.5 1 V 3 12 1.5 10-4/C 4 pF 70 ESDA14V2BP6 14.2 18 1 0.1 3 1.5 5.8 25 2/8 ESDAXXXP6 Characteristics Figure 4. Peak power dissipation versus initial junction temperature Figure 5. Peak pulse power versus exponential pulse duration (Tj initial = 25 C) PPP[Tj initial] / PPP[Tj initial=25C] 1.1 1.0 0.9 0.8 0.7 0.6 PPP(W) 1000 Tj initial = 25C ESDA6V1P6 & ESDA6V1-5P6 100 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 175 ESDA14V2BP6 Tj initial (C) 10 1 tp(s) 10 100 Figure 6. Clamping voltage versus peak pulse current (Tj initial = 25 C, rectangular waveform, tp = 2.5 s) Figure 7. Junction capacitance versus reverse applied voltage (typical values) IPP(A) 100.0 C(pF) 80 70 ESDA6V1P6 & ESDA6V1-5P6 F=1MHz VOSC=30mVRMS Tj=25C 60 50 ESDA14V2BP6 ESDA6V1P6 & ESDA6V1-5P6 10.0 40 30 20 ESDA14V2BP6 1.0 VCL(V) 0.1 0 10 20 30 40 50 tP=2.5s Tj initial =25C 10 VR(V) 0 60 70 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Figure 8. Relative variation of leakage current versus junction temperature (typical values) Figure 9. Peak forward voltage drop versus peak forward current (typical values) IR[Tj] / IR[Tj=25C] 1.E+04 IFM(A) 1.E+00 ESDA6V1P6 & ESDA6V1-5P6 1.E+03 ESDA14V2BP6 VR =12V 1.E-01 Tj =125C 1.E+02 Tj =25C 1.E-02 1.E+01 Tj(C) 1.E+00 25 50 75 ESDA6V1P6 & ESDA6V1-5P6 VR =3V VFM(V) 1.E-03 150 100 125 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 3/8 Ordering information scheme ESDAXXXP6 Figure 10. ESD response @ VPP = 15 kV air discharge (ESDA6V1-5P6) 2 Ordering information scheme ESDA ESD Array Breakdown Voltage 6V1 = 6.1 Volts min. 14V2 = 14.2 Volts min. Number of lines protected (optional) 5 = 5 lines Type Blank = Unidirectional B = Bidirectional 6V1 - x B Px Packages P6 = SOT-666 for ESDA14V2BP6 and SOT-666IP for ESDA6V1P6 and ESDA6V1-5P6 4/8 ESDAXXXP6 Package information 3 Package information Table 3. SOT-666 Dimensions Dimensions b1 L1 Ref. Millimeters Min. Typ. Max. Min. Inches Typ. Max. 0.024 0.007 0.013 L3 b A A3 b D E1 0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.27 0.60 0.018 0.18 0.003 0.34 0.007 b1 D 0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.012 0.067 0.067 0.051 A E L2 E A3 E1 e L1 L2 e L3 Figure 11. SOT-666 Footprint (dimensions in mm) 0.50 0.62 2.60 0.99 0.30 5/8 Package information Table 4. SOT-666IP Dimensions Dimensions b1 L1 L4 ESDAXXXP6 Ref. Millimeters Min. Typ. Max. Min. Inches Typ. Max. 0.024 0.007 0.013 A L3 b D E1 0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.60 0.27 0.60 0.018 0.18 0.003 0.34 0.007 A3 b b1 D A L2 E A3 0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.024 0.012 0.067 0.067 0.051 E E1 e L1 L2 e L3 L4 Figure 12. SOT-666IP Footprint (dimensions in mm) 0.30 0.50 0.99 0.21 0.62 1.40 2.60 0.20 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 ESDAXXXP6 Ordering information 4 Ordering information Part Number ESDA6V1P6 ESDA6V1-5P6 ESDA14V2BP6 Marking B SOT-666IP C A SOT-666 2.9 mg 3000 Tape and reel Package Weight Base qty Delivery mode 5 Revision history Date 07-Feb-2006 26-Jun-2006 Revision 1 2 Changes ESDA6V1P6, ESDA6V1-5P6 and ESDA14V2BP6: datasheets merged. ECOPACK statement added. Some curves combined. Reformatted to current standards. Modified package information to show both SOT-666 and SOT-666IP. 7/8 ESDAXXXP6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 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